中英文对照勘察报告

第一节 前 言 One Preface

受上海贝岭股份有限公司委托，我院对拟建“上海贝岭股份有限公司6英寸集成电路芯片项目”场地进行工程地质勘察工作。

Consigned by Shanghai Beiling Corp.Ltd., Our Institute has done the engineering geological investigation on the site on which Shanghai Beiling Sis-Inch Project is going to be carried out.

一、工程概况Ⅰ.General introduction of the project

拟建场地位于上海市张江高科技园区3-1、3-2、3-3地块。场地西邻泰隆电子有限公司，东抵哈雷路，北近郭守敬路。场地长约500m，宽约150m。

The site is located in Block 3-2, Block 3-3 of Shanghai Zhangjiang High Technology Zone, with Tairong Electronics Co., Ltd. to the east, and Rd.Guoshoujing to the north. The site is 500m in length, and 150m in width.

场地内拟建建（构）筑物分2期进行。一期拟建芯片生产主厂房、动力站房各1栋，4层工程师办公楼与餐厅、3层行政办公楼各1栋，以及变电站、水塔、油罐等附属设施。二期拟建生产主厂房、动力站房各1栋及气站、水塔、油罐等，总建筑面积83186m2。各拟建建（构）筑物设计技术参数见表1。

The building project on the site is to be carried out in two stages. During the first stage, the following shall be finished: one main chip workshop, one engine workshop, one four-storey office building and dining hall, one three-storey administrative office, and other accessories such as the transformer substation, the water tower, the oil can, etc. During the second stage, one main workshop, one engine workshop, and the gas station, the water tower and the oil can, etc. should be finished. It spreads 83186 square meters. The design technical indexes for the buildings are listed in Table 1.

表1

编

号

1

2

3

4

5

6

7

8

9 拟 建 物 性 质 特 征 一 览 表 建（构）筑物 名称 建筑 面积 (m2) 结构 类型 层数 或 高度 跨度 (m) 柱距 (m) 基础设计资料 型 式埋深 (m) 荷重(kN) 最大 一般备注 芯片生产主厂房框架 动力站房框架 行政办公楼框架 工程师办公楼框架 临时餐厅 水塔 φ8m 框架 3层桩基2层桩基3层桩基4层桩基 桩基-2.5～-3.5 混凝土 半埋气站变电站 其它辅助设施